Printed Circuit Board Assemblies
Valuetronics has experience in many methods of printed circuit board assembly from through hole and mixed technology to customized fine pitched surface mount technologies.
Our process capabilities include:
- 0201 chips
- 0.4mm fine pitch IC
- Flip chip
- CSPs
- BGAs and micro -BGAs
- Chip on Board (wire bonding)
- Lead free assembly (RoHS compliant)
- IN-Circuit-Test ( ICT)
- Automatic Optical Inspection ( AOI)
- X-Ray Inspection
Our
equipments include:
- 12 SMT lines (more than 10 Millions chips placement/day)
- Lead Free Reflow ovens
- Lead Free Dual Wave machines
- 13 Bonding machines
